As the core device of power electronic converter, the reliability of IGBT power modules is currently the focus of academic and industrial circles. In this paper, based on the actual structure of IGBT module, an electrical-thermal-mechanical simulation model of IGBT module is constructed by means of finite element analysis software. Aiming at the problem of IGBT module bond wire failure, the effects of different bond wire materials and surface metallized layer materials on temperature and stress nephograms of IGBT module are researched. The simulation results show that there is a strong correlation between the selection of bond wire material and the temperature distribution inside the module, and the selection of metallized layer material has a strong correlation with the stress distribution inside the module. Therefore, the temperature and stress in the module can be greatly reduced by reasonably choosing the type of metallized layer material and the bond wire material, thereby it also can reduce the risk of bond line failure and improve the reliability of the module.