Electro-Thermal Coupling Simulation of Press-Pack IGBT in MMC System
Ting HOU , Langzhong GOU , Yan LI , Zhipeng HE , Yuke JI , Dingkun MA , Jianpeng WANG , Laili WANG
›› 2020, Vol. 14 ›› Issue (5) : 28 -36.
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Electro-Thermal Coupling Simulation of Press-Pack IGBT in MMC System
- Ting HOU 1
- , Langzhong GOU 2
- , Yan LI 1
- , Zhipeng HE 1
- , Yuke JI 1
- , Dingkun MA 2
- , Jianpeng WANG 2
- , Laili WANG 2
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Abstract
At present, most voltage source converters (VSC) in known VSC-HVDC projects adopt modular multi-level converter (MMC). Among the MMC sub-modules, half-bridge sub-module is most widely used. The high reliability of HVDC transmission system requires the construction of half-bridge sub-modules to adopt press-pack insulated gate bipolar transistor IGBT. In this paper, the electro-thermal coupling simulation of the press-pack IGBT half-bridge module MMC is carried out, and an electro-thermal coupling simulation method based on Foster thermal network is explored. The safe operation domain of MMC system is described from the perspective of thermal stability.
Keywords
press-pack IGBT / Foster thermal network / electro-thermal coupling / MMC
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Funding
Science and Technology Project of China Southern Power Grid Co., Ltd.(ZBKJXM20180046)
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